Welcome to Chip in Sampa 2026
São Paulo, SP, Brazil
August 24 to 28, 2026
Chip in Sampa 2026 is one of the most important international microelectronics events
held in Brazil. The event will take place from August 24 to 28, 2026, at the University of São Paulo (USP), in São Paulo, Brazil’s leading economic and technological hub. This year’s edition is organized by the Laboratory of Micro and Nanoelectronics (LAMINA – LSI/LME) at the Polytechnic School of the University of São Paulo (USP). This edition is particularly special as we celebrate the 40th anniversary of the Brazilian Microelectronics Society (SBMicro), marking four decades of contributions to the advancement of microelectronics in Brazil. Chip in Sampa 2026 brings together six events:
The program also includes industrial panels, business forum, technical sessions,
meetings, and award ceremonies, bringing together academic and industry
professionals, graduate and undergraduate students. A special panel will celebrate
SBMicro’s 40-year history and its important contribution to the development of
microelectronics in Brazil. These activities provide an excellent environment for
scientific exchange, networking, collaboration, and the development of the next
generation of microelectronics researchers and professionals.
The events are sponsored by the Brazilian Microelectronics Society (SBMicro) and the
Brazilian Computer Society (SBC), with the support of leading international professional
societies, including IEEE EDS, IEEE CASS, IEEE CEDA, IEEE IMS, and IFIP. We also
gratefully acknowledge the support of the Brazilian funding agencies CAPES, CNPq,
and FAPESP.
We sincerely thank all the academic societies, companies, institutions, committees,
reviewers, authors, speakers, and volunteers whose dedication and collective effort
have made Chip in Sampa 2026 possible.
We hope that everyone will enjoy the technical program, establish new collaborations,
and join us in celebrating 40 years of SBMicro and its contribution to the Brazilian
microelectronics community.
Welcome to the University of São Paulo, and welcome to Chip in Sampa 2026!
João Antonio Martino
General Chair – Chip in Sampa 2026
Keynote Speakers
Prof. Dr. Cor Claeys
Fellow IEEE, Fellow ECS
KU Leuven, Leuven, Belgium
Title:A Century Field Effect Transistor (FET 100): From Dream to 3D System-on-Chip
Abstract
Short Bio
The micro and nanoelectronics device evolution towards fully integration in our daily life has been driven by Moore’s law, requiring the use of a zoo of novel materials, the development of innovative processing schemes and the switch toward novel design concepts and device architectures. Semiconductors are everywhere, are essential to solve humanitarian challenges and are at the basis of innovative technologies such as autonomous driving, electrical vehicles (EV), healthcare applications, artificial intelligence (AI) etc.
A century ago, the first patent on the Field Effect Transistor (FET) was filed by Julius E. Lilienfeld. He never developed the concept and only in 1960 D. Kahng and M. Atilla demonstrated for the first time the MOSFET operation, a key building bloc of the Intel 4004 microprocessor in 1971. Nowadays, device architectures such as FinFETs, TFETs, Gate-All-Around, nanowires (NWs), nanosheets (NSs), Forksheet structures, and CFET for logic, memory, imaging and analog/RF building blocks enable System-on-Chip (SoC) applications.
The strong progress achieved in silicon technology and the heterogenous integration of Ge and III V technologies on a silicon platform results in the on-chip integration of building blocks with different functionality. There is also a commercial breakthrough of GaN devices, although dependent on the application competing with SiC. Major trends in process integration approaches are reviewed and technological challenges of some process modules and device structures highlighted. The main driving force has become to control PPAC: Power, Performance, Area and Cost.
Prof. Cor Claeys was with imec, Leuven, Belgium from 1984 till 2016 and had various managerial positions. He also became Professor at the KU Leuven (Belgium) in 1990. His main interests are semiconductor technology, device physics, low frequency noise phenomena, radiation effects and defect engineering. He is teaching a variety of short courses in different parts of the world.
He co-edited books on “Low Temperature Electronics”, “Germanium-Based Technologies: From Materials to Devices” and recently “The FET Centennial – Celebrating the Field-effect Transistor”. He wrote monographs on “Radiation Effects in Advanced Semiconductor Materials and Devices”, “Fundamental and Technological Aspects of Extended Defects in Germanium”, “Random Telegraph Signals in Semiconductor Devices” and “Metals in Silicon- and Germanium-Based Technologies: Origin, Characterization, Control and Electrical Impact”. Two books are translated in Chinese. He (co)authored 16 book chapters, over 1200 conference presentations and more than 1400 technical papers (of which more than 430 in peer-reviewed scientific journals). He is editor/co-editor of 70 Conference Proceedings.
Cor Claeys is a Fellow of the Electrochemical Society and of IEEE. He was Founder of the IEEE Electron Devices Benelux Chapter, Chair of the IEEE Benelux Section, elected Board of Governors Member and EDS Vice President for Chapters and Regions. He was EDS President in 2008-2009 and Division Director on the IEEE Board of Directors in 2012-2013. He is a recipient of the IEEE Third Millennium Medal and received the IEEE EDS Distinguished Service Award. He is a Distinguished Lecture of the IEEE Electron Devices Society. Within the Electrochemical Society, he was Chair of the Electronics & Photonics Division (2001-2003). In 2004, he received the ECS Electronics & Photonics Division Award. In 2016 he received the Semi China Special Recognition Award for outstanding involvement in the China Semiconductor Technology International Conference (CSTIC).
Nikil Dutt
Departments of Computer Science, Cognitive Sciences, and EECS, University of California, Irvine, USA
Title: Towards Adaptive, Resilient CyberPhysical Human Systems (CPHS)
Abstract
Short Bio
CyberPhysical Human Systems (CPHS) – ranging from small form-factor IoT devices to complex system-of-systems with humans-in-the-loop – manage complexity through hierarchically layered design abstractions, requiring a tight coupling of computation, communication and control across the abstraction stack to meet energy, performance, reliability and security needs. CPHS exhibit highly dynamic behaviors that must meet multiple goals simultaneously, e.g., resiliency, energy, heat, cost, performance, security, etc. I propose the use of mindful AI strategies to enable continual runtime learning and evolution, allowing the system to adapt dynamically and maintain overall resilience. Mindful AI leverages computational self-awareness through introspection (i.e., modeling and observing its own internal and external behaviors) combined with both reflexive and reflective adaptations via cross-layer physical and virtual sensing and actuations applied across multiple layers of the system abstraction stack. I will highlight our experience in applying these principles across multiple CPHS projects spanning nanoscale computing, healthcare IoT, data center memory, and end-to-end autonomous system computational pipelines.
Nikil Dutt is a Distinguished Professor (CS, Cognitive Sciences, and EECS) and the Associate Dean for Research (Donald Bren School of ICS) at the University of California, Irvine (UCI). He received a PhD from the University of Illinois at Urbana-Champaign (1989). His research interests are in embedded and cyber-physical systems, EDA, computer architecture & compilers, distributed systems, healthcare IoT, and brain-inspired architectures and computing. His research group has done foundational research in Architecture Description Languages (ADLs) for customized processors, software controlled memories, and self-aware, cross-layer design of adaptive, resilient computing systems. He has received over 20 best paper awards and nominations at premier EDA and embedded systems conferences, as well as multiple departmental and campus awards for excellence in teaching and mentoring at UCI. Professor Dutt has served as EiC of ACM TODAES, and AE for ACM TECS and IEEE TVLSI. He has served on the steering, organizing, and program committees of several premier EDA and Embedded System Design conferences, and has also served on several ACM (Publications Board, SIGBED, SIGDA, TECS) and IEEE (ESL) advisory boards. He is an ACM Fellow, IEEE Fellow, and recipient of the IFIP Silver Core Award.
Andrew Taberner
Professor of Bioengineering,
University of Auckland
Title: Challenges of Measuring Heat in Bioinstrumentation Systems
Abstract
In many bioengineering applications, it is necessary to measure extremely small amounts of heat, including the heat released by active tissue as it performs mechanical work, the heat released or absorbed by drugs as they react with biological targets, and the heat produced by flowing viscous fluids. In some cases, the rate of heat transfer may be as low as 1 nW, with resulting temperature changes on the order of 1 mK or less. Measuring such small energetic quantities poses significant experimental challenges.
This talk presents an overview of methods and instruments developed to address these challenges. These include calorimeters for measuring the heat released by cardiac muscle tissue while performing work against dynamically modulated loads that mimic the impedance of the systemic circulation, systems for quantifying the heat and temperature changes experienced by Newtonian and non-Newtonian drugs delivered at high speed through needles or needle-free injectors, and exploratory techniques for assessing heat production in microlitre-scale quantities of drugs and reagents. In some drug-delivery applications, temperature changes of up to 60 °C
have been observed.
The presentation highlights both the measurement challenges involved and the instrumentation approaches that make such measurements possible in bioengineering applications.
Prof. Cor Claeys was with imec, Leuven, Belgium from 1984 till 2016 and had various managerial positions. He also became Professor at the KU Leuven (Belgium) in 1990. His main interests are semiconductor technology, device physics, low frequency noise phenomena, radiation effects and defect engineering. He is teaching a variety of short courses in different parts of the world.
He co-edited books on “Low Temperature Electronics”, “Germanium-Based Technologies: From Materials to Devices” and recently “The FET Centennial – Celebrating the Field-effect Transistor”. He wrote monographs on “Radiation Effects in Advanced Semiconductor Materials and Devices”, “Fundamental and Technological Aspects of Extended Defects in Germanium”, “Random Telegraph Signals in Semiconductor Devices” and “Metals in Silicon- and Germanium-Based Technologies: Origin, Characterization, Control and Electrical Impact”. Two books are translated in Chinese. He (co)authored 16 book chapters, over 1200 conference presentations and more than 1400 technical papers (of which more than 430 in peer-reviewed scientific journals). He is editor/co-editor of 70 Conference Proceedings.
Cor Claeys is a Fellow of the Electrochemical Society and of IEEE. He was Founder of the IEEE Electron Devices Benelux Chapter, Chair of the IEEE Benelux Section, elected Board of Governors Member and EDS Vice President for Chapters and Regions. He was EDS President in 2008-2009 and Division Director on the IEEE Board of Directors in 2012-2013. He is a recipient of the IEEE Third Millennium Medal and received the IEEE EDS Distinguished Service Award. He is a Distinguished Lecture of the IEEE Electron Devices Society. Within the Electrochemical Society, he was Chair of the Electronics & Photonics Division (2001-2003). In 2004, he received the ECS Electronics & Photonics Division Award. In 2016 he received the Semi China Special Recognition Award for outstanding involvement in the China Semiconductor Technology International Conference (CSTIC).
Acknowledgment: The Microsoft CMT service was used for managing the peer-reviewing process for this conference. This service was provided for free by Microsoft and they bore all expenses, including costs for Azure cloud services as well as for software development and support.
