Juan C. Rey
Siemens Digital Industries Software, USA
The Impact of AI in 3D IC Design
Abstract: AI is pushing the limits of semiconductor performance. Today’s AI
accelerators already deliver 20, 50 even 100 petaflops of compute — and 150 is not far
away. Achieving that future demands a fundamental shift from 2D design to 3D
heterogeneous integration to realize superior system-level PPA. However, traditional 2D
design flows can no longer keep pace with the scale and cross-domain complexity of 3D
ICs. Engineers now grapple with millions of micro-bumps and interconnects, intricate
Multiphysics interactions from dies to systems and massive design data across teams.
The question is no longer “if” — but “how” — the industry can unlock the full potential of
3D ICs for AI, with AI. In this keynote, Juan Rey, General Manager at Siemens EDA, will
examine the top barriers to 3D IC performance and reliability and outline the industry’s
path toward a more open, holistic, AI-driven design flow. He will introduce five essential
design strategies spanning from early system planning through multi-die sign-off, that
help design teams accelerate design convergence, enhance predictability, and reduce
design costs. The audience will also see real-world examples of how design teams use
Siemens’ unified AI-driven design flows and digital twin technologies to deliver reliable
3D IC systems at AI scale.
Juan’s BIO
Juan C. Rey returned to the Calibre Segment and was appointed Sr. Vice President,
Segment Leader/General Manager for Siemens EDA in April 2025 and December 2025
added the responsibility of CTO Siemens EDA. Prior to his appointment as GM, Juan
led the Central Engineering Solutions Team focused on 3D flows.
He transitioned to the Central Engineering Solutions Team after serving as Vice
President of Government Programs for Siemens EDA, where he was responsible for
defining technical programs to support government initiatives since 2023.
Prior to his work with Government Programs, Juan held the role of Vice President of
Calibre Engineering. He joined Mentor Graphics in 2001 as Senior Engineering Director
for Mentor’s industry-leading Calibre product line, directing all development activities for
Calibre products, a role he performed until December 2021.
Juan holds a degree in Nuclear Engineering from Universidad Nacional de Cuyo,
Argentina. The author or co-author of numerous papers and conference presentations,
he has served in technical board of directors such as Semiconductor Research
Corporation (SRC) and the UCLA Center for Domain Specific Computing.