Please click here for the PDF version of the Call for Paper.

Important Dates:
Abstract Submission:
March 31, 2019
Paper Submission Deadline:
April 7, 2019
Rebuttal Period:
May 13-17, 2019
Notification of Acceptance:
May 27, 2019
Camera Ready Deadline:
June 9, 2019

SBCCI is an international forum dedicated to integrated circuits and systems design, test and electronic design automation (EDA), held annually in Brazil. The 32nd SBCCI will take place in São Paulo, the economic center and most important metropolis in Brazil. The goal of the symposium is to bring together researchers in the areas of EDA, design and test of integrated circuits and systems. The scope of the symposium includes technical sessions, tutorials and panels, as well as an exhibition and working group meetings. The best papers presented at the symposium will be invited to resubmit an extended version to be considered for publication at the IEEE Design & Test and at at the Springer Nature ALOG (Analog Integrated Circuits and Signal Processing).

Paper Submission

SBCCI strongly encourages international submissions. Prospective authors from around the world are invited to submit manuscripts in English for consideration by the Program Committee. Manuscripts must contain a maximum of 6 pages, two-column, in US-Letter size, following the ACM format and be prepared for double-blind review.Submissions of manuscripts previously published by other conferences or journals will not be considered by the program committee. SBCCI submissions must be made electronically (in PDF format) via the conference website.

A complete template (Latex, Word-Mac and Word-Windows) to prepare your paper is available Here.

 

Click here to submit your paper:
https://www.softconf.com/j/sbcci2019

 

The proceedings will be published by the ACM and will remain available at the IEEE Xplore and ACM Digital Library. Please, first the abstract should be sent and after that, the paper.
Click here to submit your paper. (Not available yet)

Remind the important dates.

For authors with accepted articles:

1) After reviewing the paper by following the reviewer(s) suggestions, authors should upload the correctedcamera-ready paper once again via our online submission system (SOFT CONF)

2) After camera-ready submission deadline, authors will receive an e-mail with instructions to fill out and upload copyright form, as well as meet the latest IEEE XploreⓇ requirements for PDF files.

 

The areas of interest include:

• System level modeling and synthesis
• Hardware-software co-design and co-verifcation
• High-level and logic synthesis
•Physical design of ICs and systems
•EDA – Electronic Design Automation
•Testability issues, design for test techniques
•Design and modeling languages and applications
•Analog, Digital and mixed signal designs
•Embedded systems and Cyber-physical systems design
•System-on-chip, IP reuse and plataform-based designs
•Low power tools and designs techniques
•Verification, simulation, emulation and prototyping techniques
•Reconfigurable architectures and novel applications of FPGAs
•Nanoelectronic circuits, nanoarchitectures and nanocomputing

Chairs

General Chair
João Martino, USP, Brazil
martino@usp.br

Program Chairs
Marcelo Lubaszewski, UFRGS, Brazil
Matteo Reorda, Politec. di Torino, Italy

Tutorials Chair
Sergio Bampi, UFRGS, Brazil

Panels Chairs
Nilton Morimoto, USP, Brazil
Davies Monteiro, UFMG, Brazil

Local Arrangements Chairs
Ana Neilde Silva, USP, Brazil
Ricardo Rangel, USP, Brazil
Emerson Moretto, USP, Brazil

Finance Chairs
Victor Sonnenberg, FATEC, Brazil
Celina Yunaka, USP, Brazil

Publicity Chair
Linnyer Ruiz, UEM, Brazil

Publication Chair
André Mariano, UFPR, Brazil

Exhibition Chair
Walter Santana, LSITEC, Brazil

North America Liaison
Nikil Dutt, UC Irvine, USA

Europe Liaison
Michael Hubner, Ruhr-Univ. Bochum, Germany

Asia Liaison
Rui Martins, Uni. Macau, China

Latin America Liaison
Victor Grimblat, Synopsys, Chile

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