Welcome to Chip in Sampa 2026

São Paulo, SP, Brazil
August 24 to 28, 2026

 

The “Chip-in-Sampa 2026” is the most important microelectronics international event that takes place in Brazil. This event is held on August 24 to 28, 2026 in São Paulo, the Brazilian economic center, and its organization is led this year by the Laboratory of Integrated Systems (LSI), LSITEC and Polytechnic School of University of São Paulo (USP).

The Chip-in-Sampa 2026 is composed by six events:

In addition, there are Industrial Panel and many technical and administrative meetings. During the Opening and Closing sessions different Awards will be presented. All activities are focused on academic and industrial professionals, graduated and undergraduate students, allowing a fruitful meeting of the microelectronics community and contributing to the emergence of the next generation of Brazilian microelectronics researchers and professionals.

The different events organized within Chip-in-Sampa 2026 are sponsored by Brazilian Microelectronic Society (SBMicro) and Brazilian Computer Society (SBC) and co-sponsored by many international societies, such as: IEEE Electron Device Society (EDS), IEEE Circuits and Systems (CAS), IEEE Council on Electronic Design Automation (CEDA), IEEE Instrumentation & Measurement, Association for Computing Machinery (ACM), ACM-special interest group on design automation (SIGDA) and International Federation for Information Processing (ifip). A special thanks to the Brazilian sponsoring agencies CAPES, CNPq and FAPESP.

We would like to thank all the support from academic societies, from companies and from Brazilian agencies. We also would like to thank the Executive Committee, the Local Arrangements Committee, the reviewers and the authors of the manuscripts. Together, this was an enormous human effort that enabled the success of this conference. Thank you very much! We hope the microelectronics community enjoys Chip-in-Sampa 2026 and all activities that are carefully prepared for the audience.

Welcome to São Paulo
João Antonio Martino
Chip-in-Sampa 2026
General Chair


Keynote Speakers

CorClaysProf. Dr. Cor Claeys
Fellow IEEE, Fellow ECS
KU Leuven, Leuven, Belgium

Abstract: To be defined
Short Bio